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Inspection Equipment Product List

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Hard Disk Surface Defect Inspection Device - Laser Explorer

Hard Disk Surface Defect Inspection Device - Laser Explorer

Detecting fine surface defects such as scratches and pits on the surface of hard disks.

By irradiating the surface of the hard disk with a high-power laser, we detect fine surface defects such as scratches and pits, classify them by defect type, and display the results. Not only can we detect scratches with high sensitivity through simultaneous irradiation of multiple lasers, but we can also determine the uneven shapes of the defects. Features: - Detection of minute defects using high-power lasers - High scratch detection capability - Discrimination of defect unevenness - Automatic focus for all units - Excellent cost performance - Customization support - Automatic inspection for one cassette - Compatible with transparent glass substrates

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Disk Chipping Inspection Device DSiS-2015

Disk Chipping Inspection Device DSiS-2015

Detecting chipping, dirt, etc. on glass substrates, media surfaces, and edge areas with high speed and high precision.

This is a mass production line inspection device that detects glass substrates, media surfaces, edge chipping, dirt, etc., with high speed and high precision through image analysis captured by a CCD camera. It can automatically sort disks based on pass/fail judgments, and the inspection results can be communicated to and managed by a higher-level system. - Throughput: up to 800 PPH (depending on inspection conditions) - Footprint: Main body: (W) 1380 × (D) 1700 × (H) 2100 mm (W) 1810: including cassette transfer section PC rack: (W) 570 × (D) 630 × (H) 1850 mm - Cleanliness: Class 10 (at 0.1μm) - Compatible with automatic transport systems Inspection specifications: - Supported disks: 1.89”, 2.5”, 3.5” - Inspection area: entire area excluding the inner peripheral end face (or designated area) - Sensor element size: 7μm - Pixel resolution: inspection area (dependent on lens magnification) - Lens magnification: 1x to 3x (designed according to inspection content) - Design example: 2.5” disk, 800 PPH Inspection area: Inner circumference: R10.0 to R15.0 (2x) Outer circumference: R31.0 to R32.5 (3x)

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Laser-type wafer surface defect inspection device - Laser Explorer

Laser-type wafer surface defect inspection device - Laser Explorer

Transparent wafers also undergo high-speed inspection! High-output lasers detect tiny scratches and particles!

The "Laser Explorer" is the latest wafer surface defect inspection device that also supports transparent wafers. A high-power laser detects minute defects such as scratches, pits, and particles! It can be utilized for shipping and receiving inspections of wafers, as well as for quality control in the epitaxial process! 【Other Features】 ■ High throughput (inspects 25 wafers in a cassette in about 40 minutes) ■ Discriminates the unevenness of defects ■ Automatic focusing for all samples ■ Customization support ■ Automatic inspection for one cassette ■ High-precision marking for defects (optional) ■ Defect review using a laser microscope (optional)

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Wafer surface defect inspection device with review function

Wafer surface defect inspection device with review function

Equipped with a review microscope! Defects detected can be observed in real-time with the microscope.

By irradiating a high-power laser onto a wafer on a rotating stage, the entire surface is inspected at high speed, detecting minute defects. By combining multiple channels such as scattering, reflection, and phase shift, defect detection suitable for various applications can be achieved, allowing for discrimination based on defect types such as unevenness. ■ Features of the device - High-speed inspection (approximately 181 seconds for 12 inches) - Equipped with a review microscope - The microscope can be selected as either a laser microscope or a differential interference microscope - High-precision scribing using the microscope for analysis with SEM, etc. - Optional edge inspection functionality available

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Microscopic wafer surface defect inspection device

Microscopic wafer surface defect inspection device

High-precision inspection equipment compatible with transparent materials.

This is a surface defect inspection device equipped with a differential interference microscope, which is also applicable to transparent materials. It is capable of outputting defect maps through comprehensive inspections and allows for microscopic observation of detected defects. ■ Features of the device - Defect extraction and discrimination functions using proprietary image processing technology - High-precision marking while observing defects - Enables observation and creation of defect albums based on defect coordinates for wafers inspected by other devices - Development of a crystal defect detection function is underway.

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Wafer appearance inspection device (automatic visual inspection device)

Wafer appearance inspection device (automatic visual inspection device)

Automating visual inspection of wafer defects.

■This is a device that responds to the following requests and issues! - We want to automate visual inspection of wafer (substrate) defects. - We want to reduce and prevent variations in pass/fail judgments among inspectors. - We want to save inspection data and trace quality. - We want to automatically discriminate defects. ■Features of the device - It can automatically detect, extract, and discriminate visually identifiable defects. - We can propose an optical system optimized for the types of defects. - We can propose both manual and automatic transport (cassette to cassette). - It also implements AI functions, allowing for improved defect discrimination accuracy through ongoing learning.

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